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Electronic adhesive

Sunstar offers a wide variety of under-fill materials which is silicon rubber modified epoxy based. This unique original technology gives following features.

  • Lower internal stress and lower CTE than ordinary epoxy resin after curing.
  • Lower substance warpage.
  • Excellent shock resistance.
  • Excellent capillary flow.

Our fine electronics materials are used in below market

Smart phone Cell phone
Lap top PC
Portable game device
Digital still camera

Comparison with conventional epoxy under-fill

Product line up

Feature
(Application)
Product Curing
condition
Viscosity
(mPa?s)
25℃
Tg
(℃)
CTE
(ppm/℃)
Modulus
(GPa)
Rework
ability
Storage
condition
Shock resistance
(Mobile device etc)
#1027 120℃5min.
150℃3min.
1,500 85 69 2.7 OK 6months
under 5?C
Thermal cycle
resistance
(Mobile device etc)
#1090C 150℃5min. 1,800 165 58 3.2 OK 6months
under -20?C
#1090A 150℃5min. 1,800 150 67 2.7 OK 6months
under -20?C
Thermal cycle
resistance
(Automotive)
#1093A 125℃20min. 10,000 120 38 6.0 - 6months
under 5?C
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